【英文标准名称】:Harmonizedsystemofqualityassessmentforelectroniccomponents-Processassessmentschedule:printedboardassemblyfacilities
【原文标准名称】:电子元器件用质量评估协调体系.过程评估一览表:印刷电路板组装设备
【标准号】:BSCECC200025-1998
【标准状态】:现行
【国别】:英国
【发布日期】:1998-08-15
【实施或试行日期】:1998-08-15
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:误差修正;印制电路板;使用说明;电子设备及元件;过程控制;规范(验收);布置;质量评估;安全措施;缺陷;报告;作标记;手册;认可试验;详细规范;印制电路;验证;识别方法;组装;消费者与供货者的关系;加工设备;资格鉴定;定货;电气元件;质量保证体系;审计;检验
【英文主题词】:
【摘要】:ThisPASspecifiestheterms,definitions,symbols,qualitysystem,assessmentandverificationmethods,andotherrequirementsrelevanttotheoperationofaprintedboardAssemblyFacilityincompliancewiththegeneralrequirementsoftheCECCSystemforelectroniccomponentsofassessedquality.WhereasThchnologyApprovalrequiresthatconstituentaddedelectroniccomponentsshallbeCECC-approved,undertheProcessApprovalsystem,printedboardsandthecomponentsattachedtothemneednotnecessarilybeCECC-approveditems.TheuseofCECC-approvedaddedcomponentsandprintedboardsisrecommendedandwhereallofthemaresoreleasedbytheAssemblyFacilityunderaCECCCertificateofConformity.However,itisimpracticaltomaketheuseofCECC-approvedcomponentsmandatoryandthewishesofthecustomerareofprimaryconsideration.WhereoneormorenonCECC-approvedcomponentsareusedinaspecificassembly,theapprovedspecialistAssemblyFacilitymayreleaseitashavingbeenassembledusingaCECC-approvedprocessusingthefollowingwording:"Thissolderedprintedboardassemblyis(or"Thesesolderedassembliesare)releasedbyaCECC-approvedfacilityashavingbeenassembledandtestedusingprocesses,methodsandtestedusingprocesses,mtheodsandcontrolsmeetingtherequirementsofCECC200025".
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:42P;A4
【正文语种】:英语